IMBM-Q170A
1-2
1.3 Specifications
SYSTEM
Form factor
micro ATX
CPU
Intel® 6th Generation(Skylake-S) Core™ i7/ i5 /i3, Pentium® and
Celeron® 14nm LGA 1151 socket Processor
Supports Intel
®
14nm CPU
Supports Intel
®
Turbo Boost Technology 2.0*
*Intel
®
Turbo Boost Technology 2.0 support depends on the CPU types.
Memory
4 x DIMM, DDR4 (2133/1866 MHz, max. 64GB)
non-ECC, un-buffered memory
Dual-channel memory architecture
Chipset
Intel
®
Q170 Express Chipset
I/O Chipset
NCT6791D+ F81216HD
Ethernet
1 x Intel® PHY i219LM Giga LAN (support Intel® AMT 11.0)
1 x Intel® i211AT Giga LAN, RJ45 x 2
BIOS
1 x 128Mbit Flash ROM, AMI BIOS
Wake on LAN
Yes (WOL/PXE)
Watchdog Timer
1~255 steps by software program
TPM
Yes
H/W Status Monitor
Monitors CPU/Chassis temperature
Monitors Vcore/5V/3.3V/12V voltages
Monitors CPU/Chassis fan speed
Smart Fan Control
CPU Fan/Chassis Fan x2
Power State
S3, S4, S5
Expansion slot
1 x PCIe 3.0/2.0 [x16] slot
1 x PCIe 3.0/2.0 [x4] slot (open edge)
1 x PCIe 3.0/2.0 [x1] slot (open edge)
1 x PCI slot
Battery
Lithium battery
Power requirement
1 x 24-pin ATX connector
1 x 8-pin (2 x 4) ATX 12V power connector
Form factor
Micro-ATX 9.6” x 9.6” (244 mm x 244 mm)
Gross weight
1.76 lb (0.8 Kg)
Operating
temperature
32
o
F~140
o
F (0
o
C~60
o
C)
Storage temperature
-40
o
F~185
o
F (-40
o
C~85
o
C)
Operating humidity
0%~90% relative humidity, non-condensing
Certificate
CE/FCC
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