Contents
Specifications
...........eecssssssssessssssesesseeseseecseessseseseceeeenenesesesseneseacacenseesssenseesenasessaaseesseesenseorseaeaeseaeneaey
3
Parts
Locations
and
Disassembly
INStructiOns
........ccccceeeseseeeeeeeeceseseeeeneeeseesecesneseseessnesseaeees
4to6
Bol
DT
E
RII
odes
say
ca
toes
iaenveccaraiechcansiadesnnesasmesnccsnscwatoecasbebnducnaecnea
dhauatea
sta
vase!
cee
onseetaaa
dened
aatiracsnonntenie
7
Parts
Layout
07
P.
C.
Boards
.......ccssssssssssssssssecsecnesssserenseeantensesessnssesensserseesssesenseaeseneenseeseenersensens
8
to
10
Schematic
Diagram
.........-ccceccorscsscssesssssssasecsasssescrersresensessesesesessacsrearssereseseesessesssensonaecsenonssnarons
11
to
12
Wiritng
Diagram
.........-.ssessesssessssssscnsssssrsesererssssessensenenssesasenacaeseassseseasoaenensenensrononeauansnsansensenesaens
13
to
14
Electrical:
Parts
EAS
tx
iccscddie
facieedcs
toeta duets
oedthe
deck
lcaeelalSancgededd
ducted
antes
asel
eat
tecnageban
ceca
iensievaetenests
desea
15
to
16
Exploded
View
(General)
........ssssssssscsssscsssssressessensssssseaesssnensasensessssesnsreneseneaeasssensesseuseeneeseonses
17
to
18
Mechanical
Parts
List/Packing
Parts
List
.........
ccc
esessssssssssseeseceseeseesseeeaeetenessnsseesseeseesssesseesseesenrenenenees
19
Packing
Method
View
........ssssssssssssesecssseeeseseesssscessenenenenstessararsracacasssscsseeressesensnsnensssnenesauscsraasesaueerensess
20
Semiconductors
Lead
Identifications
..........ccceceeseeseceeceeeeeeeeeesreseecessseeesueecsueuseeeussavasssensaseceseetenseeenes
21