63
11
065G040247312K---3 MLCC 0402 47nF -10% 16V X7R TDK 2ndSOURCE
065G040247312K---A MLCC 0402 47nF -10% 16V X7R SAMSUNG 2ndSOURCE
C101,C106,C11
0
065G040250931C---A MLCC 0402 5pF +-0.25pF 50V NPO SAMSUNG
065G040250931C---3 MLCC 0402 5pF -0.25pF 50V NPO TDK 2ndSOURCE
C412,C413 065G040256031J---Y MLCC 0402 56pF +-5% 50V NPO YAGEO
065G040256031J---3 MLCC 0402 56pF -5% 50V NPO TDK 2ndSOURCE
C406 065G0603475A5K---3 MLCC 0603 4.7uF +-10% 10V X5R TDK
065G0603475A5K---T
MLCC 0603 4.7uF -10% 10V X5R TAIYO
YUDEN
2ndSOURCE
C401,C404,C40
9
065G0805106A5K---A MLCC 0805 10uF +-10% 10V X5R SAMSUNG
065G0805106A5K---3 MLCC 0805 10uF -10% 10V X5R TDK 2ndSOURCE
U402 070GHDCP500HDC HDCP CODE
FB401,FB402,F
B406
071G-56K121--M CHIP BEAD
071G-56K121 CHIP BEAD 2ndSOURCE
071G-56K121-TA CHIP BEAD 120R/6000mA HCB2012KF-121T60 2ndSOURCE
FB101,FB102,F
B190
071G-59G301--M CHIP BEAD 0603 300R 25% 200mA
071G-59G301-TA
CHIP BEAD 300OHM 200mA
FCM1608KF-301T02
2ndSOURCE
D101,D103 093G--64-42-PP DIODE BAV70 0.125A/85V SOT-23 NXP
093G--64-42--P DIODE BAV70 0.5A/100V SOT23 PANJIT 2ndSOURCE
ZD101,ZD102,Z
D103,ZD104
093G-39S940--T
DIODE ZD GLZ5.6B MINI-MELF 5.6V/0.5W LL-34
PANJIT
093G-39GA01--T DIODE ZD RLZ5.6B 5.6V/0.5W SEMTECH 2ndSOURCE
093G-39S-24--T NO-SUGGEST Diode ZD RLZ5.6B ROHM 2ndSOURCE
E715 715G5270M01000004L Main Board FR-4 DS 80*72*1.6MM 12
715G5270M01000004K Main Board FR-4 DS 80*72*1.6MM 12 2ndSOURCE
715G5270M01000004I Main Board FR-4 DS 80*72*1.6MM 12 2ndSOURCE
F23G3178001 AOC LOGO
F40G-18I615-5B Safety label E2260SWDA
F40G-18N61528B ID LABEL for E60
F40G000361534A EPA5.1+WIN 7+EAPEAT GOLD
F44GBF08101 EPS
F44GBF08201 EPS
F44GBF08615-1B Carton for E2260SW Series
F52G10012C3001 130*30
F52G1801MNT005 MYLAR
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