ASML PAS 5500 User Manual

R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
Approved by:
/ / / /
Process Engineer Equipment Engineer
RIT SMFL Page 1 of 11
1 SCOPE
The purpose of this document is to detail the use of the ASML PAS 5500 Stepper. All users are expected
to have read and understood this document. It is not a substitute for in-person training on the system and
is not sufficient to qualify a user on the system. Failure to follow guidelines in this document may result
in loss of privileges.
2 REFERENCE DOCUMENTS
Batch Control PAS 5500 Training Module
Reticle Design Manual
PAS 5500 User Guide
PAS 5500 Job Definition
PAS Global Alignment Strategies
PAS 5500 Steppers up to and including /300 Stepper Introduction
3 DEFINITIONS
n/a
4 TOOLS AND MATERIALS
4.1 General Description - The ASML PAS 5500/200 is a 5x reduction, i-line stepper set up for
exposure of 6 inch wafers using 6 inch reticles. The system has 350nm resolution with a
0.48-0.60 variable numerical aperture. The maximum field size on the wafer is 22x22mm.
Overlay capability is better than 50nm. All lithography levels for a particular design are
included in a single stepper job.

ASML PAS 5500 Specifications

General

Brand	ASML
Model	PAS 5500
Category	Laboratory Equipment
Language	English

Summary

Scope of ASML Stepper Document

Reference Documents for ASML Stepper

Definitions

Tools and Materials for ASML Stepper

General Description of ASML PAS 5500/200

Specifies the ASML PAS 5500/200 stepper's reduction, resolution, NA, wafer/reticle size, and overlay capability.

Safety Precautions for ASML Stepper Operation

Operator Hazards and Safety Measures

Addresses UV light, lasers, and mechanical risks. Emphasizes safety glasses and closed covers during operation.

Tool Hazards and Handling Precautions

Covers risks related to the wafer stage, stuck wafers, reticle handling, Combi reticle, and wafer backs.

ASML Stepper Operating Instructions

Starting the ASML Stepper System

Steps to power on and initialize the system, ensuring the computer is on the Main Menu.

Loading Reticles into the Stepper

Detailed procedure for removing, opening, loading reticles into the box, and securing it.

Loading Wafers onto the Stepper

Instructions for placing wafer cassettes onto the loader and receiver stages.

Defining Batch and Running Stepper Job

Guide to setting up batch parameters: ID, job name, layer, control mode, size, and type.

Unloading Wafers from the Stepper

Procedure for safely removing processed wafers from the output cassette.

Unloading Reticles from the Stepper

Steps to safely remove the reticle box, unload reticles, and store the box.

Resetting the ASML Stepper System

Procedure for clearing all wafers from the machine via the Batch Control menu.

Handling Errors During Stepper Run

Instruction to contact the equipment engineer for any operational errors.

Introducing Layer Shift in Stepper Job

Guidance on entering layer shift values in microns within the Process Data section of a stepper job.

Appropriate Uses of the ASML Stepper

Attachments and Tests for ASML Stepper

Dose to Clear Test Procedure

Details performing a dose to clear test, including settings and analyzing exposure patterns.

FEM (Focus/Exposure Matrix) Test

Procedure for conducting a Focus/Exposure Matrix test with specified parameters.

Running RIT Daily Checks

Steps for daily system monitoring, including sensor values and lens temperature checks.

Procedure for Creating a Zero Level

Guide to creating zero level marks: reticle loading, job selection, exposure, etching, and stripping.