Hardware Technical Specification
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7 MODULE SPECIFICATION
7.1 Overall System
The notebook system consists of the following PCB assembly and modules.
7.1.1 Board assembly
Processor Upgradeable CPU (FCBGA 479)
Main Board Main System board
Inverter Board LCD Module Back-light
TOUCH PAD&AUDIO DJ
BOARD
4 LED Indicators, 2 Touch Pad Button, 5 Audio DJ
button
SO-DIMM Module Memory Expansion
Modem Board MDC
7.2 Processor
Feature: Celeron M CPU with on-die L2 cache.
FCBGA 479
[CPU Cooling System]
Function:
Dothan Core
FAN is controlled by a thermal sensor and
BIOS/ACPI OS.
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