- 16 -
Trouble shooting ECR V1.01
3-3. Solder IC
1) Much solder is soldered to all pins of IC.
4) Solder is removed, by raising the top of
the solder iron in a slanting direction.
6) In the case that a little of solder remains,
remove it by using the desoldering
equipment.
2) Solder iron is slid in the left end from the
right edge of IC like above photograph.
At this time, top of the solder iron is the
condition which only the solder is touching
and part from the pin. ( See “[ Fig ]” )
3) Most of the solder can cause to migrate it
to the left end of IC by the above work “2)”.
5) “2)” to “4)” of work are repeated.
After that become above photograph.
7) If removed solder too much with above
work “6)”, solder a little of solder again.
8) Above works to other 3 places.
Note : If stickiness appears and also
solder changes color, please add new
solder. It is easy to remove solder.
Solder
Gap
I C
IC-Pin
Solder iron
[ Fig ]
To Next Page
Loading...
