Ebyte E01-ML01DP5 - User Manual

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Overview

Function Description
Usage Features
Maintenance Features
Power Supply
Electromagnetic Interference (EMI) and Layout
Antenna Considerations
Installation and Handling
Communication Range and Bit Error Rate (BER)

The E01-ML01DP5 is a DIP module based on the original imported nRF24L01P from Nordic, Norway. It operates at 2.4GHz with a transmitting power of 100mW. This module is designed for various applications requiring reliable wireless communication.

Function Description

The E01-ML01DP5 module integrates a power amplifier (PA) and a low noise amplifier (LNA), which significantly enhance its maximum transmit power to 100mW and improve receiving sensitivity. This design addresses the limitations often encountered in modules without dedicated PA and LNA components, leading to a much-improved performance in terms of range and signal integrity.

The module supports an air data rate of 2Mbps, 1Mbps, and 250kbps, providing flexibility for different communication needs. It offers 125 communication channels, which are crucial for multi-point communication, grouping, and frequency hopping applications, allowing for robust and interference-resistant wireless links.

Communication with a microcontroller (MCU) is facilitated through an SPI interface, supporting data rates from 0 to 10 Mbps. This high-speed interface ensures efficient data exchange between the module and the host system. The module also features Enhanced ShockBurst, which is fully compatible with all NORDIC nRF24L, nRF24E, and nRF24U series devices, simplifying integration into existing nRF-based systems.

The IRQ pin can be utilized as an interrupt pin to wake up the MCU and achieve a fast response, which is beneficial for power-saving and real-time applications. Alternatively, the interrupt status can be obtained via SPI, though this method is generally not recommended due to its impact on overall power consumption and efficiency.

The CE pin can be kept at a high level for extended periods. However, it is essential to set the module to POWER DOWN mode when writing to its registers. It is recommended that the CE pin be controlled by an MCU pin for optimal management. The CE pin is connected to the LNA enable pin; when CE is high (1), the LNA is turned on, and when CE is low (0), the LNA is turned off. This operation is perfectly synchronized with the transceiver mode of the nRF24L01, meaning users do not need to manage the LNA operation separately.

For automatic response functionality, the CE pin must remain at a high level during transmission, rather than being held high for only 10µs as specified in some datasheets. The recommended operation is to set CE to high (1) when the module begins sending. After all data has been sent, CE should be set to low (0). This approach is crucial because the module immediately transitions into receiving mode after sending. If CE is low (0) at this point, the LNA will be closed, which negatively impacts receiving sensitivity.

Usage Features

The E01-ML01DP5 is designed for ease of use with its DIP package and SMA interface. The SMA interface allows for easy connection of coaxial cables or external antennas, providing flexibility in antenna placement and type. This is particularly useful for optimizing communication distance and signal quality.

The module supports a wide power supply range of 2.0V to 3.6V. For best performance, a power supply over 3.3V is recommended. The communication level is 3.3V, and users should be cautious when interfacing with 5V TTL systems, as this may pose a risk of damage to the module. If a 5V level communication line is necessary, a 1k-5.1k resistor must be connected in series, though this is not the recommended approach due to residual risk.

The module operates reliably across an industrial temperature range of -40°C to 85°C, making it suitable for demanding environments and long-term operation. Its robust design and component selection adhere to industrial-grade standards, ensuring high precision and stability.

The E01-ML01DP5 has obtained FCC, CE, and RoHS certifications, indicating compliance with international regulatory standards for electromagnetic compatibility and environmental safety.

This module is versatile and can be applied in various fields, including wearable devices, smart home and industrial sensors, security and positioning systems, wireless remote control (including drones and game controllers), healthcare products, wireless voice communication, wireless headsets, and automotive industry applications. Its robust performance and flexible features make it an ideal choice for a wide array of wireless communication projects.

Maintenance Features

To ensure the longevity and stable operation of the E01-ML01DP5 module, several hardware design considerations and maintenance practices are recommended:

Power Supply:

It is crucial to use a DC stabilized power supply with a minimal ripple factor. The module requires reliable grounding.
Always ensure the correct connection of positive and negative poles of the power supply. Reverse connection can cause permanent damage.
Verify that the power supply voltage remains within the recommended range of 2.0V to 3.6V. Voltages exceeding 3.6V will permanently damage the module.
The power supply should be stable, without frequent fluctuations.
When designing the power supply circuit, it is advisable to reserve more than 30% of the margin to ensure long-term stable operation of the entire system.
If the power supply voltage is below 2.5V at room temperature, the transmitting power will be reduced.

Electromagnetic Interference (EMI) and Layout:

The module should be positioned as far as possible from power supplies, transformers, high-frequency wiring, and other components that generate significant electromagnetic interference.
Avoid routing high-frequency digital, high-frequency analog, and power traces directly underneath the module. If routing through the module area is unavoidable, assume the module is soldered to the Top Layer, and ensure that the copper spread on the Top Layer (well-grounded) is close to the digital part of the module and routed on the Bottom Layer.
Random routing over the Bottom Layer or other layers when the module is soldered or placed over the Top Layer can negatively affect the module's spurs and receiving sensitivity.
If there are devices with strong electromagnetic interference near the module, keep them at a distance proportional to the interference strength. Isolation and shielding may be necessary.
Similarly, if there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module, maintain distance based on interference strength. Isolation and shielding may be required.
Try to avoid proximity to physical layers that use TTL protocol at 2.4GHz, such as USB3.0, as these can cause interference.

Antenna Considerations:

The mounting structure of the antenna significantly impacts module performance. Ensure the antenna is exposed, preferably vertically upward.
If the module is mounted inside a case, use a good antenna extension cable to extend the antenna to the outside.
Never install the antenna inside a metal case, as this will severely weaken the transmission distance.
Poor antenna quality or improper matching between the antenna and module can lead to reduced communication range.

Installation and Handling:

The module is a static-sensitive product. Workers must adhere to static discharge operation specifications during welding. Failure to do so can cause permanent damage.
Ensure antistatic measures are taken during installation and use, as high-frequency devices are susceptible to electrostatic discharge.
Maintain humidity within the limited range, as some parts are sensitive to humidity.
Avoid using modules under excessively high or low temperatures.

Communication Range and Bit Error Rate (BER):

Communication distance can be affected by obstacles, temperature, humidity, and co-channel interference.
Performance will be poor when testing near the ground or sea water, as they absorb and reflect wireless radio waves.
Metal objects near the antenna or placing the antenna in a metal case will affect the signal.
Incorrect power register settings or excessively high air data rates can shorten the distance.
If the bit error rate (BER) is high, check for co-channel signal interference. Move away from interference sources or modify the frequency and channel to avoid interference.
A poor power supply can cause messy code; ensure the power supply is reliable.
Poor quality or excessively long extension lines and feeders can also contribute to a high bit error rate.