GOWIN GW1N(R) Series User Manual (English)

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Gowin FPGA Products

Programming and Configuration Guide

UG290-2.3E, 02/07/2021

Table of Contents4
List of Figures6
About this Guide10
Purpose10
Related Documents10
Terminology and Abbreviations10
Table 1-1 Abbreviations and Terminology10
Support and Feedback11
Glossary12
Table 2-1 Glossary12
Configuration Modes14
Littlebee ® Family of FPGA Products14
Arora Family of FPGA Products15
Table 3-1 Configuration Modes15
Table 3-2 Configuration Modes16
Configuration Pin17
Configuration Pin List and Reuse Options17
Configuration Pin List17
Table 4-1 Configuration Pin List17
Configuration Pin Multiplexing18
Table 4-2 Pin Reuse Options19
Configuration Pin Function and Application20
Figure 4-1 Configuring Pin Reuse20
Table 4-3 Pin Function20
Figure 4-2 MCLK Frequency Setting23
Configuration Mode Introduction25
Configuration Notes25
Figure 5-1 Recommended Pin Connection27
Figure 5-2 Power Recycle Timing27
JTAG Configuration28
Figure 5-3 Trigger Timing28
Table 5-1 Timing Parameters for Cycling Power and RECONFIG_N Trigger28
Table 5-2 Timing Parameters for Power-On Again and RECONFIG_N Triggering (Arora Family)28
JTAG Configuration Mode Pins29
Table 5-3 Pin Description in JTAG Configuration Mode29
Connection Diagram for the JTAG Configuration Mode30
Figure 5-4 Connection Diagram for JTAG Configuration Mode30
JTAG Configuration Timing31
Figure 5-5 Connection Diagram of JTAG Daisy-Chain Configuration Mode31
Figure 5-6 JTAG Configuration Timing31
Table 5-4 JTAG Configuration Timing Parameters31
JTAG Configuration Process32
Figure 5-7 TAP State Machine32
Figure 5-8 Instruction Register Access Timing33
Figure 5-9 Data Register Access Timing33
Table 5-5 Gowin FPGA IDCODE34
Table 5-6 Change of TDI and TMS Value in the Process of Sending Instructions34
Figure 5-10 Read Machine Flow Chart in ID Code State35
Figure 5-11 the Access Timing of Read ID Code Instruction- 0X1135
Figure 5-12 Read ID Code Data Register Access Timing36
Figure 5-13 SRAM Configuration Flow37
Table 5-7 Count of Address and Length of One Address38
Figure 5-14 Process of Reading SRAM39
Table 5-8 TCK Frequency Requirements for JTAG40
Figure 5-15 the Embedded Flash Erasing Process of T Technology41
Figure 5-16 the Embedded Flash Erasing Process of S Technology43
Table 5-9 Readback-Pattern / Autoboot-Pattern44
Figure 5-17 Process of Programming Internal Flash View45
Figure 5-18 X-Page Programming46
Figure 5-19 Y-Page Programming47
Figure 5-20 Process of Reading Internal Flash48
Figure 5-21 Process of Reading a Y-Page49
Figure 5-22 GW1N-4 Background Programming Flow50
Figure 5-23 Transfer JTAG Instruction Sample & Extest Flow Chart51
Figure 5-24 Connection Diagram of JTAG Programming External Flash52
Figure 5-25 Process View of Programming SPI Flash SPI52
Figure 5-26 Timing Diagram of Sending 0X06 Via GW2A Series JTAG Simulating SPI53
Figure 5-27 Timing Diagram of Sending 0X06 Via GW1N Series JTAG Simulating SPI53
Table 5-10 Pin State53
Figure 5-28 Process of Use Boundary Scan Mode to Program SPI Flash54
Table 5-11 Status Register Definition55
AUTO BOOT Configuration (Supported by Littlebee Family Only)56
Figure 5-29 Connection Diagram of Daisy-Chain56
Sspi58
SSPI Mode Pins58
Table 5-12 SSPI Mode Pins58
SSPI Configuration Timing59
Configuration Instruction59
Figure 5-30 SSPI Configuration Timing59
Table 5-13 SSPI Configuration Timing Parameters59
Figure 5-31 Read ID Code Timing60
Table 5-14 Configuration Instruction60
Figure 5-32 Write Enable (0X15) Timing61
Figure 5-33 Write Disable(0X3A00) Timing61
Figure 5-34 Write Data (0X3B) Timing62
Connection Diagram for SSPI Configuration Mode63
Figure 5-35 SSPI Configuration Mode Connection Diagram63
Figure 5-36 Connection Diagram of Programming External Flash Via SSPI63
Figure 5-37 the Flow of Programming External Flash Via SSPI64
Multiple FPGA Connection View in SSPI Mode65
Mspi65
Figure 5-38 Multiple FPGA Connection Diagram 165
Figure 5-39 Multiple FPGA Connection Diagram 265
Table 5-15 Pin Description in JTAG Configuration Mode66
Figure 5-40 Connection Diagram for MSPI Configuration Mode67
Figure 5-41 Connection Diagram of JTAG Programming External Flash67
Figure 5-42 Input the Start Address for the Next Bitstream68
Figure 5-43 Set the Programming Address for the External Flash69
Figure 5-44 Connection Diagram for Configuring Multiple Fpgas Via Single Flash70
Figure 5-45 MSPI Download Timing70
DUAL BOOT Configuration (Supported by Littlebee Family Only)71
Figure 5-46 Multiple FPGA Connection Diagram in MSPI Configuration Mode71
Table 5-16 MSPI Configuration Timing Parameters71
Figure 5-47 Dual Boot Flow Chart72
CPU Mode73
Table 5-17 CPU Mode Pins73
Configuration Timing74
SERIAL Mode74
Figure 5-48 Connection Diagram for CPU Mode74
Figure5-49 CPU Mode Configuration Timing74
Figure 5-50 Connection Diagram for SERIAL Mode75
Figure 5-51 SERIAL Configuration Timing75
Table 5-18 Pin Definition in SERIAL Configuration Mode75
I 2 C Mode76
Table 5-19 SERIAL Configuration Timing Parameters76
Table 5-20 Pin Definition in SERIAL Configuration Mode76
Figure 5-52 Connection Diagram for I 2 C Mode77
Figure 5-53 I 2 C Mode Timing77
Table 5-21 I 2 C Configuration Timing Parameters77
Bitstream File Configuration79
Configuration Options79
Configuration Data Encryption (Supported by Arora Family Only)80
Definition80
Figure 6-1 Configuration Options80
Enter Encryption KEY81
Enter the Decrypt Key81
Figure 6-2 Encryption Key Setting Method81
Programming Operation82
Figure 6-3 Setting the Decryption Key82
Figure 6-4 AES Security Configure83
Programming Flow84
Figure 6-5 Prepare84
Figure6-6 Read AES Key Flow85
Figure 6-7 Program AES Key Flow86
Configuration File Size87
Figure 6-8 Lock AES Key Flow87
Configuration File Loading Time88
Figure 6-9 Bitstream Format Generation88
Table 6-1 Gowin FPGA Products Configuration File Size (Max.)88
Table 6-2 Loading Frequency of Config File89
Table 6-3 Loading Time in MSPI Mode91
Table 6-4 Loading Time in Autoboot Mode91
Safety Precautions92
Boundary Scan94
Figure 8-1 Boundary Scan Operation Schematic Diagram95
SPI Flash Selection96

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GOWIN GW1N(R) Series Specifications

General

Device Series	GW1N(R)
Category	Semiconductors
Manufacturer	GOWIN Semiconductor
Process Technology	55nm
Embedded Memory	Yes
LVDS SERDES	Yes
Core Voltage	1.2V
DSP Blocks	Yes
PLLs	Yes
Package Options	QFN, BGA
I/O Voltage	3.3V
Operating Temperature	-40°C to +100°C

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