Hi-Link HLK-7628D - Default Chapter; Table of Contents

Contents
1. PRODUCT DESCRIPTION.....................................................................................................................................1
1.1. BASIC PARAMETERS........................................................................................................................................ 1
1.2. MODULE PHYSICAL MAP................................................................................................................................ 2
2. BLOCK DIAGRAM.................................................................................................................................................2
2.1. TYPICAL APPLICATION.................................................................................................................................... 3
2.2. SPECIFICATION.................................................................................................................................................. 4
2.3. INTERFACE..........................................................................................................................................................4
3. ELECTRICAL CHARACTERISTICS..................................................................................................................... 5
3.1. POWER SUPPLY REQUIREMENTS.................................................................................................................. 5
3.2. RADIO FREQUENCY CHARACTERISTICS.....................................................................................................5
4. MODULE PIN DEFINITION.................................................................................................................................. 7
4.1. PIN DEFINITION DIAGRAM............................................................................................................................. 7
4.2. DEFAULT PIN FUNCTION (SERIAL PASSTHROUGH FIRMWARE).......................................................... 8
5. MODULE DIMENSION........................................................................................................................................11
6. REFLOW SOLDERING TEMPERATURE CURVE............................................................................................ 12