●
Do not place the device in extremely hot (refer to the specicaon of the device for the detailed
operang temperature), cold, dusty or damp locaons, and do not expose it to high
electromagnec radiaon.
●
The device cover for indoor use shall be kept from rain and moisture.
●
Exposing the equipment to direct sun light, low venlaon or heat source such as heater or
radiator is forbidden (ignorance can cause
re danger).
●
Do not aim the device at the sun or extra bright places. A blooming or smear may occur
otherwise (which is not a
malfuncon however), and aecng the endurance of sensor at the
same
me.
●
Please use the provided glove when open up the device cover, avoid direct contact with the
device cover, because the acidic sweat of the ngers may erode the surface coang of the device
cover.
●
Please use a
so and dry cloth when clean inside and outside surfaces of the device cover, do
not use alkaline detergents.
●
Please keep all wrappers aer unpack them for future use. In case of any failure occurred, you
need to return the device to the factory with the original wrapper.
Transportaon without the
original wrapper may result in damage on the device and lead to addional costs.
●
Improper use or replacement of the
baery may result in hazard of explosion. Replace with the
same or equivalent type only. Dispose of used baeries according to the instrucons provided by
the
baery manufacturer.
●
You can view the device License via the website: hp://opensource.hikvision.com/Home/List?
id=46
.
DS-K1A802A Series Fingerprint Time Aendance Terminal User Manual
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