HIMC Installation Guide Specifications
HIWIN MIKROSYSTEM CORP. 2-3
Built-in I/O
General Purpose Input 8x Opto-isolated 24V, delay time within 1ms. (Sinking, PNP)
General Purpose Output 8x Opto-isolated 24V, delay time within 1ms.
GPIO current limit Max. 100mA. Total 0.8A per bank of 8.
Power
Main power Input DC 24V / 0.6A
Power consumption Max. 14.4W
Status LED Refer to Section 2.4
Mechanical characteristics
Size (WxHxD) 57 x 180 x 140 mm.
Weight approx.1200g
Mounting DIN in an enclosure or industrial panel
Chassis construction Extruded aluminum alloy for fan-less support
Environment
Protection class IP30
Operating temp. 0°C~50°C
Storage temperature -20°C~85°C
Operating altitude Up to 2000m.
Ventilation fan-less convection cooling
Humidity 5%~95%, non-condensing
Vibration
Random: 5~500Hz, 2G
Sine: 10~500Hz, 5G
Shock 5G duration: 11ms
Certificates
EMC EN61000-6-2, EN61000-6-4
Safety
UL61010-1, UL61010-2-201,
EN61010-1, EN61010-2-201, ISO 14971
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