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HOLOPLOT X1 - Distances between Audio Modules; Ground Stacking

HOLOPLOT X1
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22X1 MD80-S Manual 1.0 en
≤ 50 mm
≤ 50 mm
GROUND STACKING
Up to ve Audio Modules can be stacked on top of each
other. Ground stacking requires a at, even, and stable
surface with sufcient load-carrying capacity.
Use all four rear-facing M10 rigging points to secure the
stacked Audio Modules from the back.
When stacking Audio Modules of different types, place
the slimmer MD96 on top of the larger MD80-S. When
the array conguration requires placing an MD80-S on
top of an MD96, ensure appropriate stabilization through
an external structure.
DISTANCES BETWEEN AUDIO MODULES
Optimal performance of Matrix Arrays requires a
consistent spacing between loudspeaker drivers across
multiple Audio Modules.
Hence, when designing a rigging system for an array of X1
Audio Modules, reduce the distance between individual
Audio Modules to a minimum. The distance should not
exceed 50 mm in any of the axes, horizontal and vertical.
If Audio Modules lack appropriate
xation to the oor or to a secure
structure, they might fall or tip.
Without xation, Audio Modules
might move due to vibrations
caused by the loudspeaker drivers.
!
IMPORTANT SAFETY AND LEGAL NOTE:
This drawing is for illustrative purposes only. Any
custom rigging, including structures supporting
ground stacking, must be designed, veried, and
approved by a qualied structural engineer.
Installation and Cooling Requirements

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