HOLOPLOT X1 User Manual

23X1 MD80-S Manual 1.0 en
HEAT GENERATION AND DISSIPATION
All power used by a loudspeaker system is eventually
converted to heat dissipated by ampliers and drivers.
Acoustic power is absorbed and converted to heat by air
and acoustic materials.
Installation and Cooling Requirements
In Sleep and Idle modes, all heat is dissipated towards
the back of the Audio Module. When playing audio, heat
is dissipated with a 60/40 front/back spread.
COOLING AND AIR FLOW
REQUIREMENTS
The internal components of the Electronics Package are
actively cooled by eight temperature-controlled fans.
To provide adequate cooling capabilities, the back of the
Audio Module is required to have access to cool air and
may not be sealed by surrounding infrastructure.
CLEARANCE REQUIRED AT THE BACK
For connectors and cable dress, there must be at least
100 mm clearance on the back of an Audio Module.
To prevent overheating, ensure
sufcient airow around the
back and sides of the Electronics
Package. Do not block the intake
fans at the bottom nor the exhaust
cooling vents on the sides. Do not
dress cables in front of intake fans
or exhaust cooling vents.
!
i
Please also refer to the Power States
and Current/Power Draw in the
Power Setup and Requirements
section for more information on the
Power States.
Air in
Air out
Heat dissipation of Modul 80-S in
different power states
POWER STATE
DIRECTION
BTU/H
W
Sleep Mode
Back
478
140
Idle
Back
1,365
400
Max. Long-Term Continuous
Front
2,129
624
Back
1,420
416
Total
3,549
1,040

HOLOPLOT X1 Specifications

General

Brand	HOLOPLOT
Model	X1
Category	Speaker System
Language	English