HP 250 G1 User Manual

Fan/heat sink assembly
NOTE: The fan/heat sink assembly spare part kit includes replacement thermal materials.
Description Spare part number
Fan/heat sink assembly for use only with computer models equipped with an AMD processor 688281-001
Fan/heat sink assembly for use only with computer models equipped with an Intel processor 685086-001
NOTE: To properly ventilate the computer, allow at least 7.6 cm (3.0 in) of clearance on the left side of the
computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor
and is designed to turn on automatically when high temperature conditions exist. These conditions are
affected by high external temperatures, system power consumption, power management/battery
conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced
through the ventilation grill located on the left side of the computer.
Before removing the fan/heat sink assembly, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and
then unplugging the AC adapter from the computer.
4. Remove the battery (see
Battery on page 36), and then remove the following components:
●
WLAN module (see
WLAN module on page 45)
●
Hard drive (see
Hard drive on page 49)
●
Keyboard (see
Keyboard on page 54)
●
Top cover (see
Top cover on page 57)
●
Speakers (see
Speakers on page 65)
●
USB board (see
USB board on page 67)
●
Power connector cable (see
Power connector cable on page 69)
●
Display assembly (see
Display assembly on page 71)
●
System board (see
System board on page 80)
To remove the fan/heat sink assembly:
1. Disconnect the fan cable (1) from the system board.
2. Loosen the captive screws on the heat sink (2) that secure the assembly to the system board.
NOTE: The number of screws used to secure the fan/heat sink assembly to the system board varies by
computer model.
86 Chapter 4 Removal and replacement procedures ENWW

HP 250 G1 Specifications

General

Bus type	DMI
Tjunction	105 °C
Processor cache	2 MB
Processor cores	2
System bus rate	5 GT/s
Processor family	Intel® Celeron®
Processor series	Intel Celeron 1000 series for Mobile
Processor socket	rPGA988B
Processor codename	Ivy Bridge
Processor frequency	1.8 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	18
Maximum number of PCI Express lanes	16
Motherboard chipset	Intel® HM70 Express
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3-SDRAM
Maximum internal memory	6 GB
Memory layout (slots x size)	1 x 2 GB
64-bit computing	Yes
Disc types supported	CD, DVD
HDD size	2.5 \
HDD speed	5400 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Total storage capacity	320 GB
Compatible memory cards	SD, SDHC, SDXC
Number of HDDs installed	1
Number of SSDs installed	0
Display surface	Matt
Display diagonal	15.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Display number of colors	16.78 million colors
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1000 MHz
CD rewrite speed	10 x
DVD-RAM read speed	5 x
DVD+R Double Layer read speed	8 x
DVD+R Double Layer write speed	6 x
WWAN	Not installed
Data network	Not supported
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	3
Keyboard layout	-
Pointing device	Touchpad
Operating system installed	Windows 8
Form factor	Clamshell
Product type	Laptop
Product color	Charcoal
Country of origin	China
Processor ARK ID	72060
Processor package size	37.5x37.5 (rPGA988B) mm
Supported instruction sets	SSE4.x
Battery capacity	47 Wh
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cables included	AC
Operating altitude	0 - 3050 m
Non-operating altitude	0 - 4570 m
Storage temperature (T-T)	-15 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	20 - 85 %
Sustainability certificates	RoHS, EPEAT Silver, ENERGY STAR

Weight and Dimensions

Depth	247 mm
Width	376 mm
Height	35.8 mm
Weight	2450 g