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HP 3105m - Page 67

HP 3105m
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2. Remove the heat sink assembly (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the heat sink assembly is removed:
Thermal pads are located on the heat sink (1) and on the base enclosure (2) underneath the
heat sink.
Reverse this procedure to install the heat sink assembly.
ENWW Component replacement procedures 59

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