2. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits. The following illustration shows the replacement thermal
material locations.
Thermal paste is used on one system board component (1) and on the heat sink area (2) that services it.
Reverse this procedure to install the heat sink.
Lock bracket
To remove the lock bracket, use this procedure and illustration.
Table 5-9 Lock bracket description and part number
Description Spare part number
Lock bracket M00433-001
Before removing the lock bracket, follow these steps:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 26).
2. Remove the bottom cover (see Bottom cover on page 26).
3. Remove the battery (see Battery on page 27).
Remove the lock bracket:
1. Remove the Phillips M2.0 × 3.0 screw (1) that secures the lock bracket to the computer.
Component replacement procedures 35
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