EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove battery module
2. Dis-fasten ODD screw*
3. Remove ODD
4. Remove BASE rubber feet*2
5. Dis-fasten BASE Cap screw*2
6. Disassemble BASE Cap*2
7. Dis-fasten BASE screw*15
8. Disassemble KB Deck
9. Pull out FFC*3 (Power, Touchpad, Fingerprint)
10. Pull out FFC*1 (USB)
11. Dis-fasten daughter boards screw*1 (Power)
12. Remove daughter boards*2 (Power, USB)
13. Pull out wire cable connectors*2 (LCD, DC cable)
14. Pull out wire cable*2 (speaker, woofer)
15. Pull out HDD assembly
16. Dis-fasten DC BKT screw*2
17. Remove DC BKT
18. Dis-connect antenna cable connector
19. Remove WLAN module
20. Dis-fasten motherboard screw*5
21. Remove motherboard
22. Dis-fasten Speaker R&L screw*1
23. Remove speaker -L & -R
24. Pull out fan cable
25. Dis-fasten Fan screws*1
26. Remove Fan module
27. Dis-fasten thermal module screw*7
28. Remove thermal module
29. Pull out DC cable connector
30. Dis-fasten Hinge screw*5
31. Remove hinge-up
32. Remove LCD Bezel screw pad*2
33. Dis-fasten LCD Bezel screws*2
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