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HP G61-400 - Notebook PC Maintenance And Service Guide

HP G61-400 - Notebook PC
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Removal and replacement procedures
Maintenance and Service Guide 4–41
The following illustration shows the replacement thermal material locations for computer models equipped with
graphics subsystems with discrete memory.
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board components each time the fan/heat sink assembly is removed. Thermal grease is located on the section of
the fan/heat sink assembly 1 that services the processor 2. A thermal pad is located on the section of the
fan/heat sink assembly 3 that services the Northbridge chip 4. Thermal pads are also located on intermediate
sections of the fan/heat sink assembly 5 and 7 that service components 6 and 8 on the system board.
Replacement thermal grease and pads are included with all system board, fan/heat sink assembly, and processor
spare part kits.
Reverse this procedure to install the fan/heat sink assembly.

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HP G61-400 - Notebook PC Specifications

General IconGeneral
BrandHP
ModelG61-400 - Notebook PC
CategoryLaptop
LanguageEnglish

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