Polyethylene low density packaging materials contains at least 100%
recycled content.
EPE-Expanded Polyethylene packaging materials contains at least 15%
recycled content.
HP follows these guidelines to decrease the environmental impact of product
packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in
packaging materials.
Use readily recyclable packaging materials such as paper and
corrugated materials.
Reduce size and weight of packages to improve transportation fuel
efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
Material Usage
This product does not contain any of the following substances in excess of
regulatory limits (for reference of these limits please refer to the HP General
Specification of the Environment
(
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/
gen_specifications.html
):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
QuickSpecs
HP Mini 2140 Notebook PC
Technical Specifications
DA - 13185 North America — Version 9 — June 30, 2009
Page 29
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