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HP OMEN 15 User Manual

HP OMEN 15
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An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry.
Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or non-conductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
20 Chapter 4 Removal and replacement preliminary requirements

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HP OMEN 15 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack
Country of originChina
Market positioningGaming
Built-in microphoneYes
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
Display surfaceMatt
Display diagonal15.6 \
Native aspect ratio16:9
Bus typeDMI3
SteppingR0
Tjunction100 °C
Processor cache6 MB
Processor cores4
Processor modeli7-6700HQ
System bus rate8 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-6700 Mobile series
Processor socketBGA 1440
Processor threads8
Processor codenameSkylake
Processor frequency2.6 GHz
Processor cache typeSmart Cache
Configurable TDP-down35 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.5 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)45 W
Maximum number of PCI Express lanes16
Motherboard chipsetIntel® HM170
Pointing deviceTouchpad
Memory slots2x SO-DIMM
Internal memory16 GB
Memory clock speed2133 MHz
Memory form factorSO-DIMM
Internal memory typeDDR4-SDRAM
Memory layout (slots x size)2 x 8 GB
HDD speed7200 RPM
HDD capacity1000 GB
SSD capacity256 GB
HDD interfaceSATA
SSD interfacePCI Express
Storage mediaHDD+SSD
SSD form factorM.2
Total storage capacity1256 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Processor codeSR2FQ
Processor ARK ID88967
Processor package size42 x 28 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
On-board graphics card ID0x191B
Discrete graphics card modelNVIDIA® GeForce® GTX 965M
On-board graphics card modelIntel® HD Graphics 530
Discrete graphics card memory4 GB
Discrete graphics memory typeGDDR5
On-board graphics card familyIntel® HD Graphics
On-board graphics card memory2.005 GB
Maximum on-board graphics card memory1.7 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1050 MHz
Battery capacity61.5 Wh
Battery life (max)11 h
Number of battery cells3
AC adapter power120 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
AC adapter output voltage19 V
Cable lock slot typeKensington
WWANNot installed
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.2
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
Sustainability certificatesRoHS, EPEAT Silver, ENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth253 mm
Width382 mm
Height24.5 mm
Weight2090 g

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