EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Quantity of
items
included in
product
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
DP cable*1, USB3.0 cable*1, Power cord*1,
Adapter*1
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove stand by quick release button to separate the stand and monitor head.
2. Use tool to separate rear cover from monitor head through tear down slot.
3. Use tool to release screw from bucket, then separate bucket and trim from monitor head by hand.Separate top corner first
then pull up the bucket to separate bucket and SHD.
4. Use tool to release screws on SHD, then separate the SHD from monitor head, separate the mylar and thermal pad which on
the SHD. Release two screws on the SHD to separate the release button and springs.
5. Tear the tape from lamp wire ,motor wire ,color sensor wire, then disassemble the lamp wire, motor wire ,color sensor wire,
LVDS FFC*4 and ctrl-BD FFC from connector.
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