3.
Remove the fan/heat sink assembly (2). Disconnect the fan cable (3) from the system board.
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach the assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is
used on the heat sink (1) and the processor (2). Thermal pads are used on the Northbridge
contact (3) and Northbridge chip (4), the graphics/heat sink contact (5) and graphics subsystem
chip (6), and graphics/heat sink contact (7) and capacitors (8). Replacement thermal material is
included with all fan/heat sink assembly, system board, and processor spare part kits.
4. Turn the system board upside down, with the expansion port and external monitor port toward
you.
ENWW
Component replacement procedures
91
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