HP ProBook 5330m User Manual

Heat sink
Description Spare part number
Heat sink (includes replacement thermal material) 650372-001
Before removing the heat sink, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn
the computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet
and then unplugging the AC adapter from the computer.
4. Remove the battery (see
Battery on page 37).
5. Remove the service access cover (see
Service access cover on page 39).
6. Remove the keyboard (see
Keyboard on page 52).
7. Remove the fan (see
Fan on page 55).
8. Remove the top cover (see
Top cover on page 57).
9. Remove the speakers (see
Speakers on page 67).
10. Remove the system board (see
System board on page 68).
Remove the heat sink:
1. Position the system board upside down on a flat surface.
2. Loosen the four captive screws (1) that secure the heat sink to the system board.
3. Lift the heat sink straight up (2) and remove it from the system board.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink
components (1) and (2), and the system board components (3) and (4), each time the heat sink is
removed. Replacement thermal material is included with all heat sink and system board spare part
kits.
70 Chapter 4 Removal and replacement procedures

HP ProBook 5330m Specifications

General

Bus type	DMI
Stepping	J1
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-2300 Mobile Series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Sandy Bridge
Processor frequency	2.1 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	21
Maximum number of PCI Express lanes	16
Motherboard chipset	Intel® QM67 Express
HDD speed	7200 RPM
HDD interface	SATA II
Optical drive type	-
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	MMC, SD
Number of HDDs installed	1
Display diagonal	13.3 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Power supply type	AC/DC
Intel segment tagging	Enterprise
Operating temperature (T-T)	41 - 95 °F
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Memory slots	1x SO-DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Memory slots (available)	0
Pointing device	Touchpad
Bluetooth version	2.1+EDR
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Professional
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Cable lock slot type	Kensington
Battery capacity	41 Wh
Battery life (max)	5.5 h
AC adapter power	65 W
Sustainability certificates	EPEAT Gold, ENERGY STAR
Product color	Black, Silver
Country of origin	China
On-board graphics card ID	0x116
Discrete graphics card model	Intel® HD Graphics 3000
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1100 MHz
Processor code	SR04S
Processor ARK ID	52220
Processor package size	37.5 x 37.5 xrPGA988B); 31 x 24 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	225 mm
Width	328 mm
Height	25.2 mm
Weight	1820 g