EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-2)
2. Remove front bezel. (see Figure 3)
3. Remove the HDD (see Figure 4-6)
4. Remove the Slim ODD (see Figure 7-8)
5. Unplug all cable conn. from PCA. (see Figure 9)
6. Remove the PCA(see Figure 10-11)
7. Remove the DIMM. (see Figure 12)
8. Disconnect cooler cable then remove the cooler from board. (see Figure13-14)
9. Remove the Battery. (see Figure 15)
10. Remove the FIO module from chassis. (see Figure 16-17)
11. Remove the SD card reader from chassis. (see Figure 18-19)
12. Remove the speaker from chassis. (see Figure 20-21)
13. Remove the PSU from chassis. (see Figure 22-23)
14. Remove the PSU chassis and remove the PSU board. (see Figure 24-34)
15. Remove the Electrolytic Capacitors from PSU board. (see Figure 35-41)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
To Next Page
Loading...
Need help?
General