3. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink and system board spare part kits.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it.
Reverse this procedure to install the heat sink.
Component replacement procedures 55
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