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HP Spectre x360 User Manual

HP Spectre x360
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7 Maintaining your computer
It is important to perform regular maintenance to keep your computer in optimal condition. This chapter
explains how to use tools like Disk Defragmenter and Disk Cleanup. It also provides instructions for updating
programs and drivers, steps to clean the computer, and tips for traveling with (or shipping) the computer.
Improving performance
You can improve the performance of your computer by performing regular maintenance tasks with tools such
as Disk Defragmenter and Disk Cleanup.
Using Disk Defragmenter
HP recommends using Disk Defragmenter to defragment your hard drive at least once a month.
NOTE: It is not necessary to run Disk Defragmenter on solid-state drives.
To run Disk Defragmenter:
1. Connect the computer to AC power.
2. Type defragment in the taskbar search box, and then select Defragment and Optimize Drives.
3. Follow the on-screen instructions.
For additional information, access the Disk Defragmenter software Help.
Using Disk Cleanup
Use Disk Cleanup to search the hard drive for unnecessary les that you can safely delete to free up disk space
and help the computer run more eiciently.
To run Disk Cleanup:
1. Type disk in the taskbar search box, and then select Free up disk space by deleting unnecessary les.
2. Follow the on-screen instructions.
Using HP 3D DriveGuard (select products only)
HP 3D DriveGuard protects a hard drive by parking the drive and halting data requests under either of the
following conditions:
You drop the computer.
You move the computer with the display closed while the computer is running on battery power.
A short time after the end of one of these events, HP 3D DriveGuard returns the hard drive to normal
operation.
NOTE: Only internal hard drives are protected by HP 3D DriveGuard. A hard drive installed in an optional
docking device or connected to a USB port is not protected by HP 3D DriveGuard.
NOTE: Because solid-state drives (SSDs) lack moving parts, HP 3D DriveGuard is unnecessary for these
drives.
Improving performance 35

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HP Spectre x360 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Optical drive typeNo
Card reader integratedYes
Total storage capacity256 GB
Compatible memory cardsSD
Number of SSDs installed1
Display diagonal15.6 \
Touch technologyMulti-touch
Native aspect ratio16:9
Speakers manufacturerBang & Olufsen
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Power adapter depth134.87 mm
Power adapter width486.92 mm
Power adapter height357.89 mm
Power adapter weight3968.94 g
Battery capacity64.5 Wh
Pointing deviceTouchpad
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
AC adapter power45 W
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
Processor operating modes64-bit
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth247 mm
Width378 mm
Height16 mm
Weight1823.44 g

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