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HP Spectre x360 User Manual

HP Spectre x360
69 pages
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Index
A
AC adapter and battery 5
AC adapter, testing 33
accessibility 56
action keys 13
identifying 12
airplane mode 16
airplane mode key 13, 16
antivirus software, using 41
audio 21
audio-out (headphone)/audio-in
(microphone) jack, identifying 6
B
backing up software and
information 42
backups 47
battery
conserving power 31
discharging 31
factory-sealed 31
nding information 31
low battery levels 31
resolving low battery level 32
battery information, nding 31
battery power 30
best practices 1
BIOS
determining version 43
downloading an update 44
starting the Setup Utility 43
updating 43
Bluetooth device 16, 18
Bluetooth label 15
boot order
changing 51
bottom 15
buttons
left TouchPad 9
power 6
right TouchPad 9
C
camera
identifying 8
using 20
camera light, identifying 8
caps lock light, identifying 10
caring for your computer 36
cleaning your computer 36
components
bottom 14
display 8
left side 6
right side 5
top 9
connecting to a WLAN 17
connector, power 5
corporate WLAN connection 17
critical battery level 32
D
Disk Cleanup software 35
Disk Defragmenter software 35
E
electrostatic discharge 55
esc key, identifying 12
external AC power, using 32
F
ngerprints, registering 40
rewall software 41
fn key, identifying 12
four-nger tap TouchPad gesture
26
G
GPS 18
H
headphones, connecting 20
headsets, connecting 21
Hibernation
exiting 29
initiated during critical battery
level 32
initiating 29
high-denition devices, connecting
23
HP 3D DriveGuard 35
HP Apps Store, visiting 1
HP Fast Charge 30
HP Mobile Broadband
activating 17
IMEI number 17
MEID number 17
HP PC Hardware Diagnostics (UEFI)
using 45
HP Recovery Manager
correcting boot problems 51
starting 50
HP Recovery media
creating 47
recovery 50
HP Recovery partition
recovery 50
removing 52
HP resources 2
HP Touchpoint Manager 42
I
IMEI number 17
infrared camera
identifying 8
infrared camera light, identifying 8
initiating Sleep and Hibernation 28
input power 53
installing
optional security cable 42
internal microphones, identifying 8
Internet security software, using 41
J
jacks
audio-out (headphone)/audio-in
(microphone) 6
Index 57

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HP Spectre x360 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Optical drive typeNo
Card reader integratedYes
Total storage capacity256 GB
Compatible memory cardsSD
Number of SSDs installed1
Display diagonal15.6 \
Touch technologyMulti-touch
Native aspect ratio16:9
Speakers manufacturerBang & Olufsen
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Thunderbolt ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Power adapter depth134.87 mm
Power adapter width486.92 mm
Power adapter height357.89 mm
Power adapter weight3968.94 g
Battery capacity64.5 Wh
Pointing deviceTouchpad
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
AC adapter power45 W
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-6200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
Processor operating modes64-bit
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth247 mm
Width378 mm
Height16 mm
Weight1823.44 g

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