HP xw4600 Quickspecs

Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the external surface designed to be frequently handled
or carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Diphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has
been voluntarily removed from most applications.
Radioactive Substances
Tributyl Tinches; TBT), Triphenyl Tinches; TPT), Tributyl Tin Oxide (TBTO)
Packaging HP follows these guidelines to decrease the environmental impact of product packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in packaging materials.
Use readily recyclable packaging materials such as paper and corrugated materials.
Reduce size and weight of packages to improve transportation fuel efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-Life
Management and
Recycling
Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic
areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
Hewlett-Packard
Corporate
Environmental
Information
For more information about HP's commitment to the environment:
[link to new HP white paper now in progress]
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
QuickSpecs
HP xw4600 Workstation
Technical Specifications
DA - 12792 Worldwide QuickSpecs — Version 19 — 9.12.2008 Page 26

HP xw4600 Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	E0
Processor cache	6 MB
Processor cores	2
Processor model	E8400
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	9
Number of Processing Die Transistors	410 M
Audio system	High Definition Audio
Product type	Workstation
Motherboard chipset	Intel® X38 Express
ECC	Yes
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD-RW
Graphics card	-
Networking features	Gigabit Ethernet (10/100/1000)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Power supply	475 W
Chassis type	Tower
Country of origin	China
Processor code	SLB9J
Processor ARK ID	33910
Processor package size	37.5 x 37.5 mm
On-board graphics card model	Not available

Weight and Dimensions

Depth	456 mm
Width	168 mm
Height	450 mm
Weight	19000 g