HP Z27i User Manual

EL-MF877-00
Template Revision B
Page 2
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Hexagonal inserted handle box wrench
Diagonal cutting nippers
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use tool to separate head and stand.
2. Use tool to release screws and disassemble the rear cover by hand.
3. Separate rubber and RC by hand.
4. Tear AL-tape and acrylic adhesive tape off and separate FFC wire from connecter.
5. Remove USB SHD and use tool to release screw.--> Separate USB BD from Main Chassis.
6. Take the lamp wire off from panel and use tool to release side mount screws.
7. Use tool to release screws on PCBs. Then tear down the gaskets, rubber and AL tapes on main chassis and separate
all connector on PCBs.
8. Use tool to release screws on CTRL BD and take Ctrl BD off from assy-BZL.
9. Use tool to separate OSD-BTN and PWR-BTN parts from BZL. And use pin at back side to separate the logo.
10. Use tool to release screws and separate VESA BKT from stand.
11. Separate cable clip from stand by hand.
12. Separate Lift front CVR from stand by hand and use tool to release screws --> separate Lift back CVR from stand.
13. Use tool to release screws --> separate tilt CVR from stand.
14. Separate Clum front CVR from stand by hand and use tool to release screws --> separate Clum back CVR from stand.
15. Tear all rubbers and release screws on base.
16. There are capacitors on Interface BD , PWR BD and USB BD
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP Z27i Specifications

General

Pixel pitch	0.233 x 0.233 mm
Aspect ratio	16:9
Response time	8 ms
Display diagonal	27 \
Display technology	LED
Vertical scan range	50 - 76 Hz
Contrast ratio (dynamic)	5000000:1
Contrast ratio (typical)	1000:1
Display number of colors	-
Display brightness (typical)	350 cd/m²
Supported graphics resolutions	720 x 400, 2560 x 1440, 1024 x 768 (XGA), 1280 x 1024 (SXGA), 1280 x 720 (HD 720), 1280 x 800 (WXGA), 1440 x 900 (WXGA+), 1600 x 1200 (UXGA), 1680 x 1050 (WSXGA+), 1920 x 1080 (HD 1080), 1920 x 1200 (WUXGA), 640 x 480 (VGA), 800 x 600 (SVGA)
Rotating	Yes
USB version	3.2 Gen 1 (3.1 Gen 1)
USB Type-A downstream ports quantity	5
Product color	Black
Country of origin	China
Market positioning	Business
Pivot angle	0 - 90 °
Tilt angle range	-5 - 20 °
Panel mounting interface	100 x 100 mm
AC input voltage	100 - 240 V
AC input frequency	50 - 60 Hz
Power consumption (max)	75 W
Power consumption (standby)	0.5 W
Power consumption (typical)	60 W
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	20 - 80 %
Sustainability certificates	EPEAT Gold, ENERGY STAR
Cables included	AC, DisplayPort, DVI, USB
Harmonized System (HS) code	85285210

Weight and Dimensions

Depth (with stand)	242.4 mm
Height (with stand)	420.4 mm
Weight (with stand)	7600 g
Depth (without stand)	65.5 mm
Width (without stand)	641 mm
Height (without stand)	379.2 mm
Weight (without stand)	5300 g