HP Z27n G2

EL-MF877-00
Template Revision B
Page 2
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the hinge ass’y via quick release bottom.
2. Remove the screw and dismantle the back cover of monitor with tool.
3. Remove middle frame with tool.
4. Tear out all tapes.
5. Dismantle the screws from Mainframe.
6. Pull out the PIN of cables, separate the mainframe and Panel.
7. Dismantle the PCBA screws and disconnect the connecters.
8. Take off board.
9. Dismantle the bezel of monitor. Remove the main board and power board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).