HP Z600 Specification

Additional Information This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2002/95/EC.
This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive - 2002/96/EC.
Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.
This product contains 0% recycled materials (by wt.)
This product is >90% recycle-able when properly disposed of at end of life.
Packaging HP Workstation product packaging meets the following (refer to the HP General Specification for the
Environment at:
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html ):
Does not contain restricted substances listed in HP Standard 011-1 General Specification for the
Environment (see link above).
Does not contain ozone-depleting substances (ODS).
Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of 100
ppm sum total for all heavy metals listed.
Maximize the use of post-consumer recycled content materials in packaging materials.
All packaging material is recyclable.
All packaging material is designed for ease of disassembly.
Reduce size and weight of packages to improve transportation fuel efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
Packaging Materials
Internal LDPE Foam: .740 kg
External Cardboard carton and insert: 1.537 kg
Manageability
Industry Standard
Specifications
This product meets the following industry standard specifications for manageability functionality:
ASF 2.0 (via integrated Broadcom LAN)
Remote Manageability
Software Solutions
The HP Z600 Workstation is supported on the following remote manageability software consoles:
LANDesk Management Suite (PSG recommended solution)
Microsoft System Center Configuration Manager
HP Client Automation Enterprise
For questions or support for manageability needs, please visit: http://www.hp.com/go/easydeploy
System Software Manager For questions or support for SSM, please visit: http://www.hp.com/go/ssm
Service, Support, and
Warranty
On-site Warranty and Service ( Note 1 ): Three-years, limited warranty and service offering delivers on-site,
next business-day ( Note 2 ) service for parts and labor and includes free telephone support ( Note 3 ) 8am -
5pm. Global coverage ( Note 2 ) ensures that any product purchased in one country and transferred to
another, non-restricted country will remain fully covered under the original warranty and service offering.
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP
third-party provider, and is not available in certain countries. Global service response times are based on
commercially reasonable best effort and may vary by country.
NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party
QuickSpecs
HP Z600 Workstation
System Technical Specifications
DA - 13277 North America — Version 51 — November 21, 2013 Page 31

HP Z600 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor cache	4 MB
Processor cores	4
Processor model	E5504
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Number of QPI links	2
Processor frequency	2 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	15
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
Audio system	Integrated High Definition Realtek ALC262 Audio, optional Creative X-Fi Titanium PCIe Audio Card, optional HP Thin USB Powered Speakers
Product type	Workstation
Motherboard chipset	Intel® 5520
Internal memory	1 GB
Memory channels	Triple-channel
Memory clock speed	1333 MHz
Maximum internal memory	24 GB
Memory layout (slots x size)	1 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD Super Multi
I/O ports	Front: 3 USB 2.0, 1 microphone in, 1 headphone out, optional 1 IEEE 1394a; Rear: 6 USB 2.0, 1 audio in, 1 audio out, 1 microphone in, 2 PS/2, 1 RJ-45 to integrated Gigabit LAN, optional 1 serial; Internal: 3 USB 2.0
Serial ports quantity	0
USB 2.0 ports quantity	9
Power supply	650 W
Display	HP LP1965 19-inch LCD Monitor, HP LP2065 20-inch LCD Monitor, HP LP2275w 22-inch Widescreen LCD Monitor, HP LP2475w 24-inch Widescreen LCD Monitor, HP DreamColor LP2480zx Professional Display (24-inch widescreen), HP LP3065 30-inch Widescreen LCD Monitor (all sold separately)
Drive bays	2 external 5.25\
Graphics card	-
Keyboard type	HP PS/2 Standard Keyboard
Expansion slots	2 PCI Express Gen2 x16, 1 PCI Express Gen2 (x8 mechanically, x4 electrically), 1 PCI Express Gen1 (x8 mechanically, x4 electrically), 2 PCI
Pointing device	HP USB Laser Scroll Mouse
Power requirements	650 watts wide-ranging, active Power Factor Correction, 85% efficient Power Supply
Storage drive type	250 GB 7200 rpm SATA NCQ SATA 250 GB
HDD controller type	SATA (10000 rpm) SATA (7200 rpm) SAS (15000 rpm)
Video card features	No integrated Graphic Card
Maximum HDD capacity	600 GB
Storage drive controller	Integrated 6 channel SATA 3 Gb/s controller with RAID (0, 1, 5 or 10) capability, optional SAS controller, LSI 3041E 4-port SAS/SATA, with RAID (0, 1 or 10) capability
Minimum storage drive space	146 GB
Non-operating altitude	9100 m
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	8 - 90 %
Operating relative humidity (H-H)	8 - 85 %
Operating system installed	Windows Vista Business
Compatible operating systems	Red Hat Enterprise Linux WS 5 64-bit, Novell Suse SLED 11
Maximum graphics card memory	0.032 GB
Chassis type	Mini Tower
Country of origin	China
Processor code	SLBF9
Processor ARK ID	40711
Processor package size	42.5 x 45 mm

Weight and Dimensions

Depth	440 mm
Width	165.3 mm
Height	445.1 mm
Weight	19000 g