MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description Notes
of items
included
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the middle bezel, and then loosen the screws to remove the main panel..
2. Loosen screws on cover with Cross Head Screw Driver, and then take off the cover.
3. Loosen the screws fixing the battery door, remove the battery door, remove the wires from the battery terminal,
and pull out the battery pack.
4. Remove the plastic cover from the battery pack, and then remove all the connected wires.
5. Loosen the screws on the rear panel. Separate panel from the main Frame.
6. Loosen the screws fixing the PCB and terminal, remove them.
7. Loosen the screws fixing the plates, remove them.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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