Seeking Technical Support and
Declaration on Hazardous Subst
Products
Contact the device supplier to obtain tec
Technical support
Documentation
Obtain documentation from the CD-ROM
SUPPORT > Products > UC&C > UC >
obtain documentation.
Pb Hg
Mechanical part
×○
Board/circuit module
×○
Signal cable
×○
Cable connector
×○
Power adapter
×○
Auxiliary equipment
×○
○：Indicates that the concentration of the haz
omogeneous ma
er
a
s o
s par
s
e
ow
standard.
×： Indicates that the concentration of the haz
homogeneous materials of this part is above th
1. Mechanical part such as shell: The steel, aluminu
2. Board and circuit module:
z The PCB pad contains lead.
z Ceramic capacitor or feedthrough capacitor or
ceramic chip contains lead.
z The resistor inside the clock oscillator is imm
z The high temperature type solder, used for the
contains more than 85% lead.
NOTE
1
z The luminescence glass of chip inductor conta
z The high temperature type solder used for the
z The glass of resistance layer and protection la
z The pin and solder of the components such as
3. Signal cables: The alloy materials such as the stee
contain lead.
4. Cable connector: For most connectors, the metal s
5. Power adapter: The interior contains lead.
6.The circuit board of the auxiliary equipment contai
two.
btaining Documentation
nces in Electronic Information
nical support.
delivered with the device o
choose
UC in http://enterprise.huawei.com to
Cd Cr6+ PBB PBDE
○○ ○ ○
○○ ○ ○
○○ ○ ○
○○ ○ ○
○○ ○ ○
○○ ○ ○
ardous substance contained in all the
li it i t f th SJ/T 11363 2006
m
requ
remen
o
e
−
ardous substance contained in all the
limit requirement.
or copper materials contain lead.
mica capacitor on the board: The
ne from lead.
connector inside the transformer,
0
ns lead.
ransistor chip contains lead.
er is immune from lead.
he IC and power unit contain lead.
, aluminum, and copper materials
ell, terminal and pin contain lead.
s lead. Same as point one and poin
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