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IBM 8863 - eServer xSeries 366 - Page 31

IBM 8863 - eServer xSeries 366
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b. Rotate the heat sink retention clip forward to its fully open position.
9. Remove the protective cover, tape, or label from the surface of the
microprocessor socket, if any is present.
10. Lift the microprocessor-release lever to the fully-open position (approximately
135° angle).
Lever closed
Lever fully
open
11. Touch the static-protective package that contains the new microprocessor to
any unpainted metal surface on the outside of the server; then, remove the
microprocessor from the package.
Attention: To avoid bending the pins on the microprocessor, do not use
excessive force when pressing it into the socket.
12. Position the microprocessor over the microprocessor socket as shown in the
following illustration. Carefully press the microprocessor into the socket.
Microprocessor
orientation indicator
Microprocessor-
release lever
Microprocessor
connector
Microprocessor
13. Close the microprocessor-release lever to secure the microprocessor.
14. Remove the heat sink from its package and remove the cover from the bottom
of the heat sink.
15. Position the heat sink above the microprocessor; then, press the heat sink into
place and close the heat-sink release lever.
Note: If you are installing an additional microprocessor in microprocessor
socket 3 or 4, a VRM must also be installed.
16. If necessary, install a VRM in the proper connector.
17. Reinstall the microprocessor tray in the server:
a. Install the air baffle in the microprocessor tray.
b. Place the air baffle on top of the heat sinks and the microprocessor baffles
c. Make sure that the microprocessor-tray release latch is open; then, push
the microprocessor tray into the server.
Chapter 2. Installing options 19

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