9. Install a heat sink on the microprocessor.
Attention: Do not touch the thermal grease on the bottom of the heat sink or
set down the heat sink after you remove the plastic cover. Touching the
thermal grease will contaminate it. If the thermal grease is contaminated, call
IBM service and support to request a replacement thermal grease kit. For
information about installing the replacement thermal grease, see “Thermal
grease” on page 80.
a. Make sure that the heat-sink release lever is in the fully open position.
b. Remove the plastic protective cover from the bottom of the heat sink.
c. Align the heat sink above the microprocessor with the thermal-grease side
down.
d. Slide the rear flange of the heat sink into the opening in the retainer
bracket.
e. Press down firmly on the front of the heat sink until it is seated securely.
f. Rotate the heat-sink release lever to the closed position and hook it
underneath the lock tab.
10. Install the microprocessor air baffle (see “Installing the microprocessor 2 air
baffle” on page 47).
11. Install PCI riser-card assembly 2 (see “Installing a PCI riser-card assembly” on
page 45).
If you have other devices to install or remove, do so now. Otherwise, go to
“Completing the installation” on page 106.
Chapter 2. Installing optional devices 79
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