6ED family - 2nd generation
Technical Description
Application Note 4 Rev. 1.3, 2014-03-23
AN-EICEDRIVER-6EDL04-1
Table of Contents
1 Scope and product family ................................................................................................................. 7
2 Technology Characteristics .............................................................................................................. 8
3 Technical description of the 6ED family – 2
nd
generation ............................................................. 9
3.1 General data sheet review ................................................................................................................... 9
3.2 Control input section ............................................................................................................................ 9
3.2.1 Highside input pins (HIN), Lowside input pins (LIN) .......................................................................... 10
3.2.2 Enable pin (EN) .................................................................................................................................. 10
3.3 Control output section (/FAULT) ........................................................................................................ 11
3.4 IC supply section ................................................................................................................................ 12
3.5 Gate drive section .............................................................................................................................. 13
3.5.1 Low side gate drive ............................................................................................................................ 13
3.5.2 High side section ................................................................................................................................ 13
3.5.3 Negative Transients at High Side Reference (pin VSx) ..................................................................... 14
3.6 Bootstrapping ..................................................................................................................................... 14
3.7 Protection ........................................................................................................................................... 16
3.7.1 Overcurrent protection (ITRIP) ........................................................................................................... 16
3.7.2 Failure reset (RCin) ............................................................................................................................ 16
3.7.3 Deadtime & Shoot Through Prevention ............................................................................................. 17
3.7.4 Undervoltage Lockout (UVLO) ........................................................................................................... 17
3.8 Calculation of power dissipation and thermal aspects ....................................................................... 17
3.9 Creepage ............................................................................................................................................ 19
3.10 Layout considerations ........................................................................................................................ 19
4 List of used parameters ................................................................................................................... 21
4.1 General ............................................................................................................................................... 21
References............................................................................................................................................................ 22
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