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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
• 3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 65 W TDP in an LGA1155 socket
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
®
HD Graphics)
Memory
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-
DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SO-
DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) JEDEC memory
Note: DDR3 1600 MHz SO-DIMMs are only supported by 3
rd
generation Intel
Core processor family processors
Chipset
Intel
®
H61 Express Chipset consisting of the Intel
®
H61 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel
®
Graphics Technology:
― High Definition Multimedia Interface* (HDMI*)
― Internal flat panel display (LVDS)
Audio
• 2+2 Intel
®
High Definition (Intel
®
HD) audio via the Realtek* ALC662 audio
codec
― In-chassis stereo speakers support (3 W/4 Ω via internal connector)
― DMIC digital microphone input (internal header)
― Analog stereo line-out (back panel jack)
― Analog line-in (back panel jack)
― Front panel Intel HD Audio/AC’97 headphones/mic support (internal
header)
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface
continued
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