Intel DZ77RE-75K - Product Description

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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor
• 3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 95 W TDP in an LGA 1155 socket
― Two PCI Express* 3.0 x16 graphics interfaces (operates in x8 mode when
both slots are populated)
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
®
HD Graphics)
― External graphics interface controller
Memory
•
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1066 MHz to +2400 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
rd
generation Intel Core
processor family processors
Chipset
Intel
®
Z77 Express Chipset consisting of the Intel
®
Z77 Platform Controller
Hub (PCH)
Audio
• 8-channel (7.1 + 2) Intel
®
High Definition (Intel
®
HD) Audio via the Realtek*
ALC898 audio codec including:
― Front panel audio header with support for Intel HD Audio and AC ’97 Audio
― Five analog audio jacks on the back panel
― Onboard S/PDIF out header and back panel optical S/PDIF out connector
• 8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface*
(HDMI*)
Graphics
• Integrated graphics support via an HDMI v1.4a interface
• Support for PCI Express 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
rd
generation Intel Core
processor family processors
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR) and hardware
management support
continued