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Intel M50CYP2SB Series - Page 3

Intel M50CYP2SB Series
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Intel® Server Board M50CYP2SB Family Technical Product Specification
3
Document Revision History
Date
Revision
Changes
May 2021
1.0
Initial production release
May 2021
1.1
• Section 4.3.1. Updated note following DDR4 DIMM Support Disclaimer
• Minor updates throughout for clarity
June 2021
1.2
• Table 2.
o Updated note in the row for Maximum Supported Processor Thermal Design Power
(TDP).
o Updated Chipset row
o Added Server Management Processor row
• Table 7. Updated row for Silver 4300 processors
• Section 7.3.1. Updated text descriptions
• Section 8.1.4. Added section on “Intel® Virtual RAID on Chip (Intel® VROC) for SATA”
• Appendix H. Updated Tables 56 and 57
• Minor updates throughout for clarity
September 2021
1.3
• Table 1, “Document References”. Added two DCM documents and the 3
rd
Generation
Intel® Xeon® Scalable Processor TMSDG.
• Section 3.1, “Processor Cooling Overview”. Changed section title and updated text.
• Section 3.1.1, “Processor Cooling Requirements”. Added section
• Figure 19, “3
rd
Gen Intel® Xeon® Scalable Processor Identification”. Updated Supported
SKUs. M SKU is not supported.
• Tables 34 and 35, “CPU to PCIe* NVMe* SlimSAS* Connector Routing”. Updated third
column for CPU 1
• Section 9.1, “Serial Port Support”. Updated Serial Port A jumper information.
• Appendix H, “Server Board Installation and Component Replacement”. Added appendix.
• Appendix I, “Supported Intel® Server Systems”. Updated tables in Sections I.1 and I.2.

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