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General| Model | Intel Core Duo Mobile 945GM |
|---|---|
| Code Name | Yonah |
| Manufacturing Technology | 65 nm |
| Number of Cores | 2 |
| FSB Speed | 667 MHz |
| L2 Cache | 2 MB shared |
| Core Stepping | C0 |
| Clock Speed | 1.66 GHz |
| L1 Cache | 64 KB (32 KB data + 32 KB instruction) per core |
| Features | Execute Disable Bit |
| Family | Core |
| Instruction Set | x86 |
| Architecture | 32-bit |
Overview of manual contents, literature, and support options.
Explains special notations for signals, variables, and instructions used throughout the manual.
Defines technical terms and acronyms for better understanding of the document.
Information on how to get technical support and order product literature from Intel.
Lists Intel literature centers and contact phone numbers for ordering documentation.
Provides a list of relevant documents for further information on the development kit.
Introduction to the evaluation board components, features, and basic setup.
Details the key hardware features of the 945GM Express Chipset Development Kit.
Lists all hardware components and documentation included in the development kit.
Describes the software drivers and utilities provided on the CD for system functionality.
Information about the pre-installed AMI BIOS, its features, and configuration capabilities.
Outlines additional hardware requirements and considerations before setting up the evaluation board.
Step-by-step guide for properly setting up the evaluation board and its components.
Instructions on how to access and modify BIOS settings for optimal evaluation board performance.
Visual representation of the Intel® 945GM Express Chipset Development Kit's architecture.
Describes the evaluation board's adherence to the ATX form factor and chassis considerations.
Explains the importance of maintaining component temperatures within functional limits for reliability.
Details the system's features, operation, and major components like GMCH and ICH7-M.
Details the clock generator's role in providing reference clocks for system components.
Explains the supported ACPI system states (S0, S3, S4, S5) and power management features.
Describes how to measure subsystem power consumption using onboard resistors.
Highlights the main components of the Intel® 945GM Express Chipset board.
Illustrates and describes the various connectors available on the rear panel of the board.
Details the location and function of configuration jumpers and switches on the board.
Explains the location and function of the board's power and reset push buttons.
Provides a legend for the LEDs and their corresponding functions on the chipset board.
Lists and describes additional headers, slots, and sockets for device attachment and configuration.
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