JVC GZ-MG330HEK - Page 42

(No.YF227<Rev.001>)2-35 2-36(No.YF227<Rev.001>)
TL7601
TL7602
TL7603 TL7604
TL7605 TL7606
TL7607 TL7608TL7609
C7601 C7602
C7603
C7621
R7701
D7501
C7605
C7607
C7610
C7614
C7615
C7617
C7619
C7622
C7701
CN7602
1 40
IC7601
12
34
IC7602
13
45
L7701
Q7702
Q7703
R7502
R7503
R7509
R7510
R7608 R7609
R7702
R7703 R7705
R7611
D7502
C7625
D7503D7504 D7505D7506
C7606
C7620
C7604
C7608
C7609
C7611
C7612
C7613
C7616
C7618
C7623
C7624
CN7501
18
CN7601
123
22 2
L7601
L7602
L7603
L7604
Q7501
Q7701
Q7704
R7501
R7506
R7507R7508
R7602
R7603
R7604
R7605
R7606
R7607
R7610
R7704
R7706
R7504
D7601
D7701
D7702
D7703
D7704
R402
S402
S403
S404
S405S406
D401
R401
S401
CN402
122
CN401
129
1
2
302
D305
TL1
D306
TL2
TL3
TL4
TL5
IC301
1
6
712
13
18
19 24
C301
C302
D301
D302
D303
D304
R301R302R303R304
L301
L302
C303
CN301
17
82
R5003
C5001
C5002
C5003
L5001
R5001
R5002
L5002
IC5001
C5004
C5005 C5006 C5007
CN5001
122
Q5001
IC5001
1 78
14
<02>CCD
LYB10120-001B
COMPONENT SIDE(A)
FOIL SIDE(B)
<04>OPE
LYB10121-001C
FOIL SIDE(B)
COMPONENT SIDE(A)
<05>MONITOR
LYB10121-001C
COMPONENT SIDE(A)
FOIL SIDE(B)
<03>SENSOR
LYB10121-001C
COMPONENT SIDE(A)
FOIL SIDE(B)
CCD,SENSOR,OPE AND MONITOR CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)