LR9548S GPS Module Technical Manual v1.52
© 2006 Leadtek Research Inc. All rights reserved. Page 14/20
Preliminar
Confidential - Information is sub
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o chan
e without
rior notice.
Reflow Profile
High quality, low defect soldering requires identifying the optimum temperature profile for reflowing
the solder paste. To have the correct profile assures components, boards, and solder joints are not
damaged and reliable solder connection is achievable. Profiles are essential for establishing and
maintaining processes. You must be able to repeat the profile to achieve process consistency. The
heating and cooling rise rates must be compatible with the solder paste and components. The amount
of time that the assembly is exposed to certain temperatures must first be defined and then maintained.
The following is an example of a typical thermal profile.
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