Lenovo ThinkServer TS150 User Manual

USB device problems . . . . . . . . . . 103
Chapter 7. Getting information, help,
and service . . . . . . . . . . . . . . . 105
Information resources . . . . . . . . . . . . 105
Using the documentation . . . . . . . . . 105
ThinkServer Web site . . . . . . . . . . . 105
Lenovo Support Web site . . . . . . . . . 105
Help and service . . . . . . . . . . . . . . 105
Before you call . . . . . . . . . . . . . 105
Calling for service . . . . . . . . . . . . 106
Using other services . . . . . . . . . . . 106
Purchasing additional services . . . . . . . 107
Appendix A. Regulatory
information . . . . . . . . . . . . . . . 109
Export classification notice . . . . . . . . . . 109
Electronic emission notices . . . . . . . . . . 109
Federal Communications Commission (FCC)
Supplier’s Declaration of Conformity (SDoC) -
United States . . . . . . . . . . . . . . 109
Japanese electromagnetic compatibility
statements . . . . . . . . . . . . . . . 111
Eurasian compliance mark . . . . . . . . . . 112
Appendix B. WEEE and recycling
information . . . . . . . . . . . . . . . 113
Important WEEE information. . . . . . . . . . 113
Recycling information for Japan . . . . . . . . 113
Recycling information for Brazil. . . . . . . . . 114
Battery recycling information for Taiwan . . . . . 114
Battery recycling information for the European
Union . . . . . . . . . . . . . . . . . . . 115
Battery recycling information for the United States
and Canada . . . . . . . . . . . . . . . . 116
Requirement for batteries containing
perchlorate . . . . . . . . . . . . . . . . 116
Appendix C. Restriction of
Hazardous Substances (RoHS)
Directive . . . . . . . . . . . . . . . . 117
China RoHS . . . . . . . . . . . . . . . . 117
European Union RoHS . . . . . . . . . . . . 118
India RoHS . . . . . . . . . . . . . . . . 118
Ukraine RoHS . . . . . . . . . . . . . . . 118
Taiwan BSMI RoHS declaration . . . . . . . . 119
Appendix D. Addition statements . . . 121
Important notes . . . . . . . . . . . . . . . 121
Particulate contamination . . . . . . . . . . . 121
German Ordinance for Work gloss statement . . . 122
Appendix E. Notices . . . . . . . . . . 123
Trademarks . . . . . . . . . . . . . . . . 124
Appendix F. Abbreviations and
acronyms. . . . . . . . . . . . . . . . 125
Index . . . . . . . . . . . . . . . . . . 127
ii ThinkServer TS150 User Guide and Hardware Maintenance Manual

Lenovo ThinkServer TS150 Specifications

General

Bus type	DMI3
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1225V5
System bus rate	8 GT/s
Processor series	Intel Xeon E3-1200 v5
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	3.7 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	3.5 \
RAID levels	0, 1, 5, 10
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	2000 GB
Maximum storage capacity	24 TB
Number of HDDs installed	2
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 8 GB
On-board graphics card ID	0x191D
On-board graphics card model	Intel® HD Graphics P530
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
PCI Express slots version	3.0
Operating altitude	0 - 3048 m
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	8 - 80 %
Power supply	400 W
Power supply input frequency	50 - 60 Hz
Redundant power supply (RPS) support	-
Chassis type	Tower
Operating system installed	Windows Server 2012 Foundation
Compatible operating systems	Windows Server 2012/2012 R2, Red Hat Enterprise Linux, SUSE Linux 11/12, Windows 10, Canonical Ubuntu 14.04, VMware vSphere 2015
Processor ARK ID	88168
Intel Secure Key Technology version	1.00
Intel® Hyper Threading Technology (Intel® HT Technology)	No

Weight and Dimensions

Depth	431 mm
Width	175 mm
Height	375 mm
Weight	12500 g