LogTag TRIX-8 V2 - Page 2

LogTag TRIX-8 V2 Work Instruction Manual Revision 10.17 Page 2/44
REVISION HISTORY
Version
Date
Author
Description
5.00
4/6/04
CW
Initial 5.00 release – released to support case changes with lightpipes & screws
5.01
5/6/04
CW
Added use of test top half case in section 2.2
5.02
15/6/04
CW
Added statement for ambient temperature specification for Test & Setup
Added torque limit for screws
Added data file management instructions
5.03
28/8/04
CW
Added serial number file maintenance instructions
Added PCBA fixture setup details
Added new images
5.04
2/9/04
CW
Revised file date/time of LT_V120.HEX firmware file
5.05
12/9/04
CW
Added APPENDIX5 : test results files and maintenance
5.06
11/10/09
CW
Added extra detail & images on riveting
6.00
9/11/04
CW
Added customisation step
6.01
14/2/05
CW
various corrections
7.00
26/5/05
CW
- Updated to include new production software (10r75) features
- New serialisation maintenance system
- Rework Customisation (APPENDIX 7) added
- Option for foam dot on battery instead of adhesive
7.01
31/5/05
CW
- typo corrections
8.00
1/4/06
CW
New TRIX PCB & hibernate
8.01
6/4/06
CW
- corrected heading on pg 23 and PIC part number on Components List
8.02
4/6/06
CW
- Correct errors in software description in Test & Setup
8.10
14/11/06
CW
- Documented features of 1.1r25 prod s/w including logging start test in Test & Setup
- Changed crystal mounting procedure to not involve soldering the can but to use RTV
8.20
24/7/07
CW
Details current procedures (which were slightly different to v8.10 WIM) and includes images
of current fixtures in use
8.30
2/8/07
CW
- 1.1 r35 production software
- Changed assembly procedure to do complete product assembly prior to Test & Setup
8.40
22/2/08
CW
- Updated firmware specification to v1.31
- Updated to prodn software version 1.1r52
- Updated OS specification to Win XP / 2000
9.00
23/10/08
CW
1.1r58 production software
- detailed Test-Setup using interface with integrated temperature sensor
- detailed Check-Final using interface with integrated temperature sensor
- detailed new Customisation-sensorcheck test using interface with integrated temperature
sensor
9.10
6/4/10
CW
- Updated software definitions and images for 1.1r84 production software
- updated secition 1.1 to define 1.4 f/w
- added image of thermistor soldering heatsink arrangement
- 1.4 firmware appendix update
- barcode scanning batch id code using issued batch document
- removed section 4 “Customisation with Sensor Check”
9.20
09/9/10
CW
- Renamed Summary flowchart section title to detail TRIX-8 & TRIX-16
- Section 1.1 updated to detail TRIX-8 & TRIX-16
- Section 1.5 updated to detail TRIX-8 & TRIX-16 PCBA handling
- Updated to detail production software version 2.0r5
- Reorganised APPENDIX numbering
- Added APPENDIX 1B : TRIX-16 Component map
- Added APPENDIX 2B : TRIX-16 Circuit diagram
- Updated APPENDIX 3 : Component list to support TRIX-16
9.21
03/05/17
CW
§2.5 : Revised thickness range to 8.3mm – 8.7mm +/- 0.05mm
10.00
12/8/19
CW
TRIX-8 v2 (MCU PIC16LF1704) – most sections changed/updated to support this.
10.01
13/8/19
CW
Small corrections in various areas
Updated APPENDIX 4 firmware specification (v1.46 fw)
Updated use of Production software v2.7 build 93
Updated use of ICP s/w LT_PM3-setup_27r88.exe
10.02
16/09/19
AC
Updated section 2.5 “Inspect Case Thickness” to 8.3 to 8.7 millimeters.
Updated OS specification to Windows 7.
10.03
14/10/19
MJ
Updated BOM, changing 1uF 0402 cap from WALSUN to YAGEO
Added missing MP part numbers to BOM
10.04
26/11/19
28/11/19
CW
MJ
§A1, §A2, §A3: Changed xtal MLCCs to 12pF.
§A4:Updated firmware specification to v1.47
Swapped “Separate PCBA’s from panel” to before “Crystal mounting”.
Updated Crystal mounting to minimise stress and to cover with RTV.
Updated Cleaning area on PCBA.
Foam dot now fitted to top of battery.
Updated Production Software version to 2.8r4
10.05
5/3/20
SS
Updated Appendix 1, 2, and 3. Revised BOM, adding ESD diode, changing PCB to
rev180220 and replacing some 0402 resistors for 0603.