LogTag TRIX-8 V2 - Page 4

LogTag TRIX-8 V2 Work Instruction Manual Revision 10.17 Page 4/44
CONTENTS
REVISION HISTORY ................................................................................................................................................... 2
CONTENTS .................................................................................................................................................................... 4
SUMMARY FLOWCHART OF LOGTAG TRIX-8/16 ASSEMBLY ...................................................................... 6
MANUFACTURING PHASE 1 : PCBA ASSEMBLY AND MOUNTING IN CASE ............................................................. 6
MANUFACTURING PHASE 2: PRODUCT ASSEMBLY & TEST .................................................................................... 7
MANUFACTURING PHASE 3: LABELLING & SHIPPING ........................................................................................... 8
1. MANUFACTURING PHASE 1 ............................................................................................................................ 9
1.1 SMD MOUNTING ..................................................................................................................................................... 9
Specific Components Required ................................................................................................................................. 9
Reference .................................................................................................................................................................. 9
Procedure ................................................................................................................................................................. 9
Special Notes ............................................................................................................................................................ 9
INSPECT .................................................................................................................................................................. 9
REFLOW TEMPERATURE ...................................................................................................................................... 9
HANDLING PROCEDURES ...................................................................................................................................... 9
1.2 SEPARATE PCBAS FROM PANEL ........................................................................................................................... 10
1.3 CLEAN RESIDUE AROUND SENSOR CIRCUIT AREA AND CRYSTAL ............................................................................ 10
1.4 IN-CIRCUIT PROGRAMMING (ICP) ......................................................................................................................... 11
Setup ....................................................................................................................................................................... 11
Procedure ............................................................................................................................................................... 11
CORRECTIVE ACTION ......................................................................................................................................... 11
1.5 TEST & CALIBRATE LOGTAG TRIX PCBA (TEST FIXTURE) .................................................................................. 12
Reason for test stage: ............................................................................................................................................. 12
Equipment required:- ............................................................................................................................................. 12
Setup for TRIX-8/16 PCBA testing ......................................................................................................................... 13
Procedure:- ............................................................................................................................................................ 14
CORRECTIVE ACTION ......................................................................................................................................... 14
1.6 MOUNTING IN CASE/ SWAGING INTERFACE CONTACTS RIVETS .............................................................................. 15
Equipment Required:- ............................................................................................................................................ 15
Procedure:- ............................................................................................................................................................ 15
Special Notes: ......................................................................................................................................................... 15
1.7 SOLDER ON ELECTRO-CAP AND SOLIDER LINK ON PCBA ...................................................................................... 16
Procedure ............................................................................................................................................................... 16
1.8 SOLDER ON THERMISTOR ....................................................................................................................................... 17
Equipment Required: .............................................................................................................................................. 17
Procedure ............................................................................................................................................................... 17
Visual Inspection .................................................................................................................................................... 18
1.9 APPLY RTV & CONFORMAL COAT ......................................................................................................................... 19
Procedure: .............................................................................................................................................................. 19
2. MANUFACTURING PHASE 2 .............................................................................................................................. 21
2.1 SOLDER ON BATTERY ............................................................................................................................................ 21
Procedure: .............................................................................................................................................................. 21
Visual Inspection .................................................................................................................................................... 21
2.2 APPLY FOAM DOT ON BATTERY ............................................................................................................................. 21
Procedure: .............................................................................................................................................................. 21
2.3 ADD SEALANT TO SENSOR AREA ............................................................................................................................ 22
Procedure: .............................................................................................................................................................. 22
Visual Inspection .................................................................................................................................................... 22
2.4 PRESS CASE HALVES TOGETHER............................................................................................................................. 23
2.5 INSPECT CASE THICKNESS .................................................................................................................................... 23
Inspection ............................................................................................................................................................... 23
2.6 PERFORM ‘ LOGTAG TEST AND SETUP’ ................................................................................................................ 24
Reason for test stage: ............................................................................................................................................. 24
Equipment required:- ............................................................................................................................................. 24