LogTag TRIX-8 V2 Work Instruction Manual Revision 10.17 Page 9/44
1. MANUFACTURING PHASE 1
The steps in manufacturing phase 1 produce product to a point where it is tested and assembled to a state
just prior to battery installation.
1.1 SMD mounting
Specific Components Required
• LogTag PCB 011220
• Paste stencil matching to PCB 011220.
• Processor is to be programmed using ICP.
• Paste type ‘NO-CLEAN’.
Reference
• Logtag 011220 component location maps for TRIX-8/16 (See APPENDIX 1)
Procedure
• Place all SMD components as per 011220 component location map detailed in APPENDEX 1 Note
differences between TRIX-8 and TRIX-16.
Special Notes
• Note orientation of LEDs
• Ensure reflow temperature profile does not exceed profile required for LEDs.
• Pasted panels to be stored horizontally before reflow at all times.
INSPECT
Visual Inspection using illuminated magnifying glass to check quality of solder
joints after reflow. Joints must be shiny and correctly formed
REFLOW TEMPERATURE
Perform regular oven temperature profiles to insure reflow soldering profiles are optimum.
HANDLING PROCEDURES
• All operators wear gloves when handling components or PCBAs
• ESD wrist-straps which are correctly grounded must be worn at all times.
• Work benches and test jigs must be kept clean and tidy at all times.
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