MS50SF7
Specification V1.0
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©
Shenzhen Minewsemi Co., Ltd.
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1)
Do SMT according to above reflow oven temperature deal curve. Max. Temperature is
260
℃
;
Refer to IPC/JEDEC standard
；
Peak TEMP<260
℃；
Times
：
≤2 times
，
suggest only do once
reflow soldering on module surface in case of SMT double pad involved. Contact us if
special crafts involved.
2)
Suggesting to make 0.2mm thickness of module SMT for partial ladder steel mesh, then
make the opening extend 0.8mm
3) After unsealing, it cannot be used up at one time, should be vacuumed for storage, couldn’t
be exposed in the air for long time. Please avoid getting damp and soldering-pan oxidizing.
If there are 7 to 30 days interval before using online SMT, suggest to bake at 65-70
℃
for
24 hours without disassembling the tape.
4)
Before using SMT, please adopt ESD protection measure.
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