Contents
About This Document ......................................................................................................... 1
1 Introduction to M590 ........................................................................................................ 1
1.1 Overview ..................................................................................................................................... 1
1.2 Block Diagram ............................................................................................................................ 1
1.3 Specifications .............................................................................................................................. 2
2 Pin Description and PCB Foot Print .............................................................................. 3
2.1 Specifications and Encapsulation ................................................................................................ 3
2.2 Pin Definition .............................................................................................................................. 4
2.3 PCB Foot Print ............................................................................................................................ 6
3 Interface Design................................................................................................................. 7
3.1 Power Supply and Switch Interfaces ........................................................................................... 7
3.1.1 Design Requirements ......................................................................................................... 7
3.1.2 VDD_EXT ....................................................................................................................... 10
3.1.3 Power-On/Off Control and Procedure .............................................................................. 10
3.1.4 RESET ............................................................................................................................. 13
3.2 UART ........................................................................................................................................ 13
3.3 DTR and RING ......................................................................................................................... 15
3.3.1 DTR Pin ........................................................................................................................... 15
3.3.2 RING Signal Indicator ..................................................................................................... 16
3.4 SIM Card Interface .................................................................................................................... 16
3.5 Running LED Indicator ............................................................................................................. 18
3.6 RF Interface............................................................................................................................... 19
3.6.1 RF Design and PCB Layout ............................................................................................. 19
3.6.2 Recommended RF Connection......................................................................................... 21
4 Electric Features and Reliability ..................................................................................... 22
4.1 Electric Feature ......................................................................................................................... 22
4.2 Temperature............................................................................................................................... 22
4.3 Current ...................................................................................................................................... 23
4.4 ESD Protection .......................................................................................................................... 23
5 RF Features ....................................................................................................................... 25
5.1 Work Band ................................................................................................................................ 25
5.2 Transmitting Power and Receiving Sensitivity ......................................................................... 25
5.2.1 Transmitting Power .......................................................................................................... 25
5.2.2 Receiving Sensitivity ....................................................................................................... 26
6 Mounting the Module onto the Application Board.................................................. 27
7 Package .............................................................................................................................. 27
8 Abbreviations ................................................................................................................... 28
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