CCS Technical Documentation Engine module
Company confidential RH-18/36/38
Issue 1 10/03 Nokia Corporation. Page 25
Memory Module
The baseband memory module consists of external burst flash memory 2Mbyte (16Mbit)
(optional: 4Mbyte (32Mbit) or 8MByte (64Mbit)). The UPP contains internal SRAM with 2
Mbit (optional: 4Mbit or 8Mbit). The UPP will not be covered here.
SIM Interface
The whole SIM interface is located in the two ASICs, UPP and UEM.
The SIM interface in the UEM contains power up/down, port gating, card detect, data
receiving, ATR-counter, registers and level shifting buffers logic. The SIM interface is the
electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile
phone (via UEM device). .
Figure 12: SIM interface
Vibra
The vibra is placed in the bottom of the phone.
Figure 13: Vibra driver circuit
UEM
UPP
C5 C6 C7
C1
C2
C3
SIMDATA
Data
SIMClk
SIMCLK
SIMIO
SIMRST
VSIM
From Battery Type
contact
SIMIO
SIMClk
Data
GND
GND
SIM
SIMIF
register
UEM
digital
logic
BSI
UIF Block
CBusDa
CBusEnX
CBusClk
C8
C4
UEMInt
0
UEM
Vibraclk
5kohm
+/-
35%
VBATDriv
VIBRA
VSADriv2
M
1u
10n
Vbat
Buzz0
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