Jetson Nano Developer Kit DA_09402_001_01 | 22
处理器
O O O O O O
主动电子零件
Active components
X O O O O O
被动电子零件
Passive components
X O O O O O
存储设备
O O O O O O
机械部件
X O O O O O
连接器/线材
X O O O O O
焊接金属
Soldering material
O O O O O O
助焊剂,锡膏,标签及耗
材
Flux, Solder Paste, label
and other consumable
O O O O O O
本表格依据
的规定编制
The table according to SJ/T 11364-2014
O:表示该有害物质在该部件所有均质材料中的含量均在GB/T 26572-2011 标准规定的限量要求
以下。
O: Indicates that this hazardous substance contained in all of the homogeneous materials for
this
part is below the limit requirement in GB/T 26572-2011.
X:表示该有害物质至少在该部件的某一均质材料中的含量超出GB/T 26572-2011 标准规定的限
量要求。
X: Indicates that this hazardous substance contained in at least one of the homogeneous
materials used for this part is above the limit requirement in GB/T 26572-2011.
此表中所有名称中含 “X” 的部件均符合欧盟 RoHS 立法。
All parts named in this table with an “X” are in compliance with the European Union’s
RoHS Legislation.
注:环保使用期限的参考标识取决于产品正常工作的温度和湿度等条件
Note: The referenced Environmental Protection Use Period Marking was determined according
to normal operating use conditions of the product such as temperature and humidity.
INDIA
India RoHS Compliance Statement
This product, as well as its related consumables and spares, complies with the reduction
in hazardous substances provisions of the “India E-waste (Management and Handling)
Rule 2016”. It does not contain lead, mercury, hexavalent chromium, polybrominated
biphenyls or polybrominated diphenyl ethers in concentrations exceeding 0.1 weight %